| Design
and Simulation (Extraction of Parameters and Optimization) |
 |
| KYOCERA SLC Technologies supports the modeling
of RLC and S parameters in the substrate, and provides the following: |
|
| |
- Optimal design applying simulation results.
(i.e. to reduce the number of proto build)
- Artwork suggestions.
- Proposal of miniaturization for consumer applications.
- Pursuit material characteristics, manufacturing ability and reliability.
- Proposal of optimal impedance design rule for manufacturing ability. |
|
 |
|
High Speed Transmission Analysis |
|
| We provide support when considering options for
circuits, substrates and modules; applying several models, and
providing optimal design proposals that meet customers’ signal
integrity expectations through our actual product experience. |
|
Electromagnetic modeling technology using HFSS or Q3D
Circuit modeling technology by HSPICE |
|
 |
|
|
|
| Power Plane Resonance and DC Current Distribution Analysis |
|
|
Electromagnetic modeling technology using SPEED XP |
|
 |
|
|
|
| Thermal and Structure Design |
|
Provide
proposals for optimal structure
and chip layout through thermal analysis.
Realize better quality through structure analysis.
Design
support for back-end process such
as assembly level reliability
and warpage.
|
|
Home News Products About us 
Japanese
KYOCERA SLC Technologies supports customers from the early design
phase with our various technologies. Through our product development
experience including assembly and long package product supply in
the industry, we provide technical consideration and proposals such as
impedance model of high speed data transition, and thermal model
of module level design. 
Page Top
