| Design
and Simulation (Extraction of parameters and Optimization) |
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| KYOCERA SLC Technologies Corporation supports the modeling of RLC and S
parameter in the substrate, and provides the followings. |
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- Optimal design applying the simulation result.
(i.e. to reduce the number of proto build)
- Artwork change suggestion.
- Proposal of miniaturization for consumer application.
- Pursuit material characteristics, manufacturing ability and reliability.
- Proposal of optimal impedance design rule for manufacturing ability. |
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High Speed Transmission Analysis |
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We support to consider circuit, substrate and module,
applies several models, and provides optimal design proposal to meet customer’s signal
integrity expectations through our actual product experience. |
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Electromagnetic modeling technology using HFSS or Q3D
Circuit modeling technology by HSPICE |
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| Power Plane Resonance and DC Current Distribution Analysis |
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Electromagnetic modeling technology using SPEED XP |
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| Thermal and Structure Design |
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Provide the consideration of optimal structure
and chip layout through thermal analysis.
Realize better quality through structure analysis.
Design support for back end process like
assembly level reliability and warpage.
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Home News Products About us 
Japanese
KYOCERA SLC Technologies Corporation strongly supports customers from the early design phase with
our various technologies. Through our products development skill including assembly and long
package product supply in industry, we provide technical consideration and proposal like
impedance model of high speed data transition, and thermal model of module level design. 
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