| Design
and Simulation (Extraction of parameters and Optimization) |
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| KYOCERA SLC Technologies Corporation supports the modeling of RLC and S
parameter in the substrate, and provides the followings. |
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- Optimal design applying the simulation result. (i.e. to reduce the number of proto build)
- Artwork change suggestion.
- Proposal of miniaturization for consumer application.
- Pursuit material characteristics, manufacturing ability and reliability.
- Proposal of optimal impedance design rule for manufacturing ability. |
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High Speed Transmission Analysis |
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We support to consider circuit, substrate and module,
applies several models, and provides optimal design proposal to meet customer’s signal
integrity expectations through our actual product experience. |
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Electromagnetic modeling technology using HFSS or Q3D
Circuit modeling technology by HSPICE |
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Power Plane Resonance and DC Current Distribution Analysis |
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Electromagnetic modeling technology using SPEED XP |
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Thermal and Structure Design |
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Provide the consideration of optimal structure and chip layout through thermal analysis.
Realize better quality through structure analysis.
Design support for back end process like assembly level reliability and warpage.
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