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SiP/PoP Substrate_Title

SiP substrate In recent years, System in Package (SiP) and Package on Package (PoP) have become necessary to meet the market needs of small and thin substrates required for digital handset equipment.


KYOCERA SLC Technologies has been enhancing and improving SLC technologies to respond to the market demand for thin and small substrates.

 Features
Applicable up to 40µm pitch for flip-chip assembly
Thin build-up laminate for SiP applications (0.3mmt for 1-2-1)
Both flip-chip and wire bonding methods are available on a board
Applicable environmentally-friendly products (Halogen-free, Lead-free)

Various surface finish options available
    (Au plating, Lead-free solder coating, OSP, etc.)

SiP Cross Section Model
 Cross Section (1-2-1)
SiP Cross Section Photo
 Specifications
Table of Design Rule

Specifications are subject to change without notice due to continual improvements in materials and manufacturing processes.


Please feel free to contact us for further information.

 Applications
SiP / PoP for mobile phones SiP / PoP for digital cameras
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