|
|
 |
In Recent years, System in Package (SiP) and Package on Package (PoP) have become necessary to meet the market
needs of small and thin substrates required for digital handset equipment.
KYOCERA SLC Technologies has been enhancing and improving SLC technologies to respond to the market demand for
thin and small substrates.
|
| Features |
 |
 Applicable up to 40µm pitch for flip-chip assembly. |
|
| Thin build-up laminate for SiP applications. (0.3mmt for 1-2-1) |
|
| Both flip-chip and wire bonding methods are available on a board. |
|
| Applicable
environmentally friendly products. (Halogen free, Lead free) |
|
Various surface finish options.
(Au plating, Lead-free solder coating, OSP,
etc.) |
|
 |
|
 |
|
|
|
 Cross
Section Photo (1-2-1) |
|
 |
|
| Applications |
|
| SiP
/ PoP for Mobile Phones |
SiP
/ PoP for Digital Cameras |
|
|
|
|
|
Japanese
Page Top
