In recent years, System in Package (SiP) and Package on Package
(PoP) have become necessary to meet the market needs of small
and thin substrates required for digital handset equipment.
KYOCERA SLC Technologies has been enhancing and improving SLC technologies to respond to the market demand for
thin and small substrates.
Features
Applicable
up to 40µm pitch for flip-chip assembly
Thin
build-up laminate for SiP applications (0.3mmt for 1-2-1)
Both
flip-chip and wire bonding methods are available on a board
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In recent years, System in Package (SiP) and Package on Package
(PoP) have become necessary to meet the market needs of small
and thin substrates required for digital handset equipment.
Applicable
up to 40µm pitch for flip-chip assembly
Cross
Section (1-2-1)
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