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FC-BGA Substrates
FC-BGA Substrates
(SHDBU)
FC-BGA Substrates
(CPCORE)
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Products > FC-BGA Substrates (SHDBU)  Japanese
 
SHDBU_Title

SHDBU KYOCERA SLC Technologies recommends SHDBU substrates for high-speed with high I/O count flip chip BGA. SHDBU substrates have high density build-up and CPCORE as a core material, which allows for a finer design rule than with conventional core material: thin and displaying good characteristics for high speed applications.


In addition to fine geometry routing at the build-up layer, routing in CPCORE is possible, so it is a suitable technology for full area array flip chip assembly and MCM. Furthermore, critical routing is possible in the CPCORE layer, and is suitable for high speed switching devices and high speed routers.

 Features
The most advanced design rule with CPCORE as core material
Optimization including quantity reduction of build-up layer
High speed signal routing in core layer available
   (suitable for high speed macro-embedded ASIC)
Package for high pin count as next generation 0.8mm pitch full area array
SHDBU Cross Section Model
 SHDBU Cross Section (2-4-2)
SHDBU Cross Section Photo
 Specifications
Table of Design Rule

Specifications are subject to change without notice due to continual improvement in materials and manufacturing processes.


Please feel free to contact us for further information.

 Applications
High-end ASIC / System LSI
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