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KYOCERA SLC Technologies recommends SHDBU for high-speed with
high I/O count flip chip BGA. SHDBU is the high density build
up substrate that has CPCORE as a core material, which we can
apply finer design rule conventional core material, thin in
thickness, and has good characteristics for high speed application.
In addition to fine geometry routing at build up layer, routing
in CPCore is possible, so it is good technology for full area
array flip chip assembly and/or MCM. And it can have critical
routing in the CPCORE layer, and is suitable for high speed
switching devices and high speed routers. |
| Features |
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 The
most advanced design rule with CPCORE in core portion. |
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| Optimization including quantity reduction of Build-up layer. |
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High speed signal routing in core layer is available.
(thats suits high speed macro-embedded ASIC) |
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| A Package for high pin count as next generation 0.8mm pitch full area array. |
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 Cross Section Photo of SHDBU (2-4-2) |
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| Applications |
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| High-end
ASIC/System LSI |
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