 KYOCERA SLC Technologies recommends SHDBU substrates for high-speed
with high I/O count flip chip BGA. SHDBU substrates have high
density build-up and CPCORE as a core material, which allows for a
finer design rule than with conventional core material: thin and
displaying good characteristics for high speed applications.
In addition to fine geometry routing at the build-up layer,
routing in CPCORE is possible, so it is a suitable technology
for full area array flip chip assembly and MCM. Furthermore,
critical routing is possible in the CPCORE layer, and is suitable
for high speed switching devices and high speed routers. |
Home News Products About us 
Japanese
The
most advanced design rule with CPCORE as core material
SHDBU
Cross Section
(2-4-2)
Page Top
