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 KYOCERA SLC Technologies' highly reliable module substrates
possess some of the most advanced design rules for build-up in the industry.
With our cutting-edge design technology and
state-of-the-art process technology, we respond to customers'
various requirements. |
| Features |
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 High-density
realized with latest wiring rule using SLC technology |
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| Various surface finish options available (Ni/Au, SAC soldering, etc.) |
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Excellent electrical and mechanical characteristics contribute to
miniaturization of parts |
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Applicable for wide range of applications form mobile digital electronics to
infrastructure equipment |
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 Cross
Section (2-4-2) |
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| Applications |
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| Module
for telecommunications |
Substrate
for multimedia devices |
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