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Module substrate which KYOCERA SLC Technologies provides has one of the most advanced design rule for build-up in the industry, with high reliability.
With our leading edge design technology and state-of-the-art process technology, we respond to customers' varieties of requirements. |
| Features |
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 Realized high-density with the latest wiring rule that made technology of SLC
the background. |
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| Available various surface finish options (Ni/Au, SAC Soldering, etc..) |
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Excellent electrical and mechanical characteristics and contributes to
miniaturization of parts. |
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Applicable wide range of applications form mobile digital appliance to the
infrastructure equipments. |
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 Cross
Section Model (2-4-2) |
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| Applications |
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| Module
for Telecommunications |
Substrate
for Multimedia Devices |
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