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FC-BGA is the Semiconductor package that has fine design rule and high reliability.
KYOCERA SLC Technologies provides IC package with more than 3000 I/Os, that complys with next generation flip-chip LSI utilizing leading edge design rule and state-of-the-art process technology.
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| Features |
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 Leaders-in
circuitization rule as Line/Space:15µm/15µm. |
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| Advanced small Via formation with the laser Via technology. |
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| Highly reliable thermosetting epoxy is used. |
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| Available various surface finish options. (Ni/Au, SAC Soldering, etc.) |
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| Applicable environmental friendly products. (Halogen free, Lead free) |
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| Applications |
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| ASIC for Server/Router |
MPU for High Performance Game Console |
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| Graphics Processer etc. |
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