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FC-BGA Substrates
FC-BGA Substrates
FC-BGA Substrates
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KYOCERA Semiconductor Components
Products > FC-BGA Substrates Japanese
 
High Pin Count FCBGA_Title

FC-BGA FC-BGA substrates are semiconductor packages with fine design rule and high reliability.


KYOCERA SLC Technologies provides IC packages with more than 3000 I/Os, and which comply with next generation flip-chip LSI utilizing cutting-edge design rule and state-of-the-art processing technology.

 Features
Leaders-in circuitization rule as line/space: 15µm/15µm
Advanced small via formation with laser via technology
Highly reliable thermosetting epoxy used
Various surface finish options available (Ni/Au, SAC Soldering, etc.)
Applicable environmentally-friendly products (Halogen-free, Lead-free)
FC-BGA Cross Section Model
 Specifications
Table of Design Rule

Specifications are subject to change without notice due to continual improvement in materials and manufacturing processes.


Please feel free to contact us for further information.

 Applications
ASICs for servers / routers MPUs for high performance game consoles
Graphics processors, etc.
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