FC-BGA substrates are semiconductor packages with fine design
rule and high reliability.
KYOCERA SLC Technologies provides IC packages with more than
3000 I/Os, and which comply with next generation flip-chip LSI
utilizing cutting-edge design rule and state-of-the-art processing
technology.
Features
Leaders-in
circuitization rule as line/space: 15µm/15µm
Advanced
small via formation with laser via technology
Highly
reliable thermosetting epoxy used
Various
surface finish options available (Ni/Au, SAC Soldering, etc.)
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FC-BGA substrates are semiconductor packages with fine design
rule and high reliability.
Leaders-in
circuitization rule as line/space: 15µm/15µm
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