E-PBGAs
are PBGA packages, exclusive for wire bonding assembly, with
a multi-step bonding pad and cavity structure. E-PBGAs are thermally
enhanced substrates with a multi-tier cavity for wire bonding and
heat slug on the back. 3 tier structures are also possible.
Features
Higher
I/O application by cavity structure and multi-step bonding pad
Thermally enhanced high performance package by applying heat slug on
cavity
Enables
low inductance by ideal design structure of ground ring and
power
lines
Specifications
Specifications are subject to change without notice due to
continual improvements in materials and manufacturing process.
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E-PBGAs
are PBGA packages, exclusive for wire bonding assembly, with
a multi-step bonding pad and cavity structure. E-PBGAs are thermally
enhanced substrates with a multi-tier cavity for wire bonding and
heat slug on the back. 3 tier structures are also possible. 
Higher
I/O application by cavity structure and multi-step bonding pad
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