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The E-PBGA is a PBGA package, exclusive for wire bonding assembly, with a multi step bonding pad and cavity structure.
E-PBGA is thermally enhanced substrate with multi tier cavity for wire bonding and heat slug on back.
3 tiers of structure is possible. |
| Features |
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 Higher I/O application by cavity structure and multi step bonding pad. |
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Thermally enhanced high performance package by applying heat slug on a
cavity. |
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Enabled low inductance by ideal design structure of a ground ring and power
lines. |
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| Application |
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| ASIC for Wireless Base Station |
Package for Embedded Use |
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Japanese
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