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E-PBGAs
are PBGA packages, exclusive for wire bonding assembly, with
a multi-step bonding pad and cavity structure. E-PBGAs are thermally
enhanced substrates with a multi-tier cavity for wire bonding and
heat slug on the back. 3 tier structures are also possible. |
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Higher
I/O application by cavity structure and multi-step bonding pad |
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Thermally enhanced high performance package by applying heat slug on
cavity |
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Enables
low inductance by ideal design structure of ground ring and
power
lines |
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