CPCORE has features of both multilayer ceramic technology and
multilayer organic technology, and complies with 200µm via pitch
routing and all layer stacked via.
CPCORE material is flexible in routing design, which contributes
to the enhancement of electrical performance. CPCORE is suitable
for semiconductor packages where high speed signal transmission
is required.
Features
Thermosetting
PPE (polyphenylether) implemented; enhancing high frequency
characteristics
200µm
BGA Pad pitch enables full area array. Stacked via for all layers
Ideal
micro strip structure available
Full layers stacked via and high density pad pitch facilitate high frequency
design
Cross
Section (7 Layer Structure)
Actual
Waveform of Stripline by TDR / Cross Section (7 Layer Type)
Specifications
Specifications are subject to change without notice due to
continual improvement in materials and manufacturing processes.
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CPCORE has features of both multilayer ceramic technology and
multilayer organic technology, and complies with 200µm via pitch
routing and all layer stacked via. 
Thermosetting
PPE (polyphenylether) implemented; enhancing high frequency
characteristics
Cross
Section (7 Layer Structure)
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