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CPCORE has features of both multilayer ceramic technology and
multilayer organic technology, and complys with 200µm via pitch
routing and all layer stacked via.
This material is flexible in routing design, and that helps
to enhance the electrical performance. CPCORE is suitable for
semiconductor packages for high speed signal transmission is
required. |
| Features |
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 Thermosetting PPE (Polyphenylether) implemented in the products which
enhances high frequency characteristics. |
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| 200µm BGA Pad pitch that enables full area arry. Stacked via for all layers. |
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| Available ideal micro strip structure. |
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Full layers stacked via and high density pad pitch facilitate high frequency
design. |
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 Cross
Section Model (7 Layers Structure) |
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| Actual waveform of Stripline by TDR / Cross Section Photo (7Layers) |
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| Applications |
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| LSI
for Servers and high-speed network devices |
LSI for high-speed use |
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| Related link |
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