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The future is created with High Density Circuit Board and Packages.
We are "Kyocera SLC Technologies".
Rapid growth of Information Technology (IT) and the great expansion in use of the Internet have driven the high-performance as well as functional excellence of digital products. This trend requires high speed, multifunctional integration, and high reliability of semiconductor and electrical components.

KYOCERA SLC Technologies (KST) merges a wide range of semiconductor packaging technologies and a world-wide customer support system of both sales and design which Kyocera Corporation has maintained with ultra routing technology, thin multilayer packaging, and a reliability evaluation system that IBM SLC division had first developed.

KST develops products such as substrates for IC packages and high density circuit boards which simultaneously achieve high performance, high reliability and good cost performance.
Chairman of the Board Tetsuo Kuba President Kazuyuki Nada
Chairman of the Board
Tetsuo Kuba
  President
Kazuyuki Nada