Rapid growth of Information Technology (IT) and the great
expansion in use of the Internet have driven the high-performance
as well as functional excellence of digital products. This trend
requires high speed, multifunctional integration, and high reliability
of semiconductor and electrical components.
KYOCERA SLC Technologies (KST) merges a wide range of semiconductor
packaging technologies and a world-wide customer support system
of both sales and design which Kyocera Corporation has maintained
with ultra routing technology, thin multilayer packaging, and
a reliability evaluation system that IBM SLC division had first
developed.
KST develops products such as substrates for IC packages and
high density circuit boards which simultaneously achieve high
performance, high reliability and good cost performance.
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Chairman of the Board
Tetsuo Kuba |
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President
Kazuyuki Nada |
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