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The future is created with High Density Circuit Board and Packages. We are "Kyocera SLC Technologies".
Chairman of the Board Makoto Kawamura President Kouji Mae
Chairman of the Board
Makoto Kawamura
  President
Kouji Mae

Rapid growth of Information Technology (IT) and great expansion of Internet enhance the high-performance as well as functional excellence of digital products. This trend requires high speed, multiple function integration, and high reliability of semiconductor and electrical components.
KYOCERA SLC Technologies (KST) merges a wide range of semiconductor packaging technologies and a world-wide customer support system of both sales and design which Kyocera Corporation has maintained with ultra routing technology, thin multi-layer packaging, and reliability evaluation system that IBM SLC division has developed.
KST will introduce products such as substrate for IC packages and high density circuit boards into the market. These products will achieve high performance, high reliability and good cost performance simultaneously.

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