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Chairman of the Board
Makoto Kawamura |
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President
Kouji Mae |
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Rapid growth of Information Technology (IT) and great expansion of Internet enhance the high-performance as well as functional excellence of digital products. This trend requires high speed, multiple function integration, and high reliability of semiconductor and electrical components.
KYOCERA SLC Technologies (KST) merges a wide range of semiconductor
packaging technologies and a world-wide customer support system
of both sales and design which Kyocera Corporation has maintained
with ultra routing technology, thin multi-layer packaging, and
reliability evaluation system that IBM SLC division has developed.
KST will introduce products such as substrate for IC packages
and high density circuit boards into the market. These products
will achieve high performance, high reliability and good cost
performance simultaneously.
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