The IBM Japan Yasu plant started its printed wired board operation
in 1971, and in 1988 developed the SLC (Surface Laminar Circuit™)
circuit board which was the world's first build-up method of
processing. Mass production of SLC circuit boards then started
in 1990. Conversely, at KYOCERA Corporation, production
of an organic high density printed wiring board using the build-up
method was started in 1996 for semiconductor packages.
2000 ~
2003 Jun.
KYOCERA Corporation concluded a business transfer agreement
with IBM Japan regarding SLC operation.
2003 Aug.
KYOCERA SLC Technologies Corporation was established
as a wholly-owned subsidiary of KYOCERA Corporation.
2003 Sep.
Started operation as a specialized producer of organic
high density printed circuit boards.
2004 Apr.
East Japan sales office is opened in Hamamatsucho, Tokyo.
(5th floor of the World Trade Center Building)
2004 Apr.
Integrated the organic material components business
possessed by KYOCERA Corporation and enhanced the business
within the company. (Currently operating at Kagoshima Sendai Plant, Kagoshima
Kokubu Plant)
2004 Jul.
Obtained ISO 9001 certification for the corporate integration system.
2004 Aug.
Established KYOCERA SLC Components Corporation as a wholly-owned manufacturing subsidiary.
2004 Oct.
Obtained ISO 14001 certification for the corporate integration system.
2005 Jun.
KYOCERA SLC Components Corporation started operation
in Ayabe City, Kyoto Prefecture, Japan.
2005 Oct.
Kagoshima Sendai plant, Kagoshima Kokubu plant and East
Japan sales office added and acquired ISO 14001 certification.
2005 Nov.
Kyushu sales office is opened in Oita City, Oita Prefecture,
Japan.
2006 Aug.
Kyushu sales office added and ISO 9001 certification
acquired.
2006 Oct.
Kyushu sales office and KYOCERA SLC Components Corporation
added and ISO 14001 certification acquired.
2007 Jul.
KYOCERA SLC Components Corp. added and ISO 9001 certification
acquired.
2008 Jan.
Merged KYOCERA SLC Components Corp. as Kyoto Ayabe Plant.
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