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History Image of history
   
  1970 ~
IBM Japan Yasu plant started the printed wired board operation in 1971, and developed the SLC (Surface Laminar Circuit™) circuit board which is the world's first build up method of process in 1988. Mass production of SLC circuit boards was started in 1990.   On the other hand, in KYOCERA Corporation, production of an organic high density printed wiring board by build up method was started in 1996, for semiconductor packages.
  2000 ~
2003 June KYOCERA Corporation concluded a business tranfer agreement with IBM Japan regarding SLC operation.
2003 Aug. KYOCERA SLC Technologies Corporation was established as a wholly subsidiary of KYOCERA Corporation.
2003 Sep. Started operation as a specialized producer of organic high density printed circuit boards.
2004 Apr. East Japan sales office is opened in Hamamatsucho, Tokyo.
(5th floor of the World Trade Center Building)
2004 Apr. Integrated the organic material components business possessed by KYOCERA Corporation and enhance the business within the company.
(currentry operating at Kagoshima Sendai Plant, Kagoshima Kokubu Plant)
2004 July Obtained ISO 9001 certification for the corporate integration system.
2004 Aug. Established KYOCERA SLC Components Corporation as a wholly owned manufacturing subsidiary.
2004 Oct. Obtained ISO 14001 certification for the corporate integration system.
2005 June KYOCERA SLC Components Corporation started operation in Ayabe City, Kyoto Pref.
2005 Oct. Kagoshima Sendai plant, Kagoshima Kokubu plant and East Japan sales office added and acquired ISO 14001 certification.
2005 Nov. Kyushu sales office is opened in Oita City, Oita Pref.
2006 Aug. Kyushu sales office added and acquired ISO 9001 certification.
2006 Oct. Kyushu sales office and KYOCERA SLC Components Corporation added and acquired ISO 14001 certification.
2007 July KYOCERA SLC Components Corp. added and acquired ISO 9001 certification.
2008 Jan. Merged KYOCERA SLC Components Corp. as Kyoto Ayabe Plant.

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